d a t a sh eet product data sheet supersedes data of 2003 sep 15 2004 apr 14 discrete semiconductors PIMH9; pumh9; pemh9 npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k
2004 apr 14 2 nxp semiconductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 features ? built-in bias resistors ? simplifies circuit design ? reduces component count ? reduces pick and place costs. applications ? general purpose switching and amplification ? inverter and interface circuits ? circuit driver. quick reference data description npn/npn resistor-equipped transistor (see ?simplified outline, symbol and pinning? for package details). symbol parameter typ. max. unit v ceo collector-emitter voltage ? 50 v i o output current (dc) ? 100 ma tr1 npn ? ? ? tr2 npn ? ? ? r1 bias resistor 10 ? k r2 bias resistor 47 ? k product overview note 1. * = p: made in hong kong. * = t: made in malaysia. * = w: made in china. simplified outline, symbol and pinning type number package marking code pnp/pnp complement npn/pnp complement philips eiaj pemh9 sot666 ? h9 pemb9 pemd9 PIMH9 sot457 sc-74 h9 ? ? pumh9 sot363 sc-88 h*9 (1) pumb9 pumd9 type number simplified outline and symbol pinning pin description pemh9 1 emitter tr1 PIMH9 2 base tr1 pumh9 3 collector tr2 4 emitter tr2 5 base tr2 6 collectortr1 handbook, halfpage mhc049 123 4 6 5 top view 654 123 r2 tr1 tr2 r1 r1 r2
2004 apr 14 3 nxp semico nductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 ordering information limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. device mounted on an fr4 printed-circuit board, single-sided copper, standard footprint. 2. reflow soldering is the only recommended soldering method. type number package name description version pemh9 ? plastic surface mounted package; 6 leads sot666 PIMH9 ? plastic surface mounted package; 6 leads sot457 pumh9 ? plastic surface mounted package; 6 leads sot363 symbol parameter conditions min. max. unit per transistor v cbo collector-base voltage open emitter ? 50 v v ceo collector-emitter voltage open base ? 50 v v ebo emitter-base voltage open collector ? 10 v v i input voltage positive ? +40 v negative ? ? 10 v i o output current ? 100 ma i cm peak collector current ? 100 ma p tot total power dissipation t amb 25 c sot363 note 1 ? 200 mw sot457 note 1 ? 300 mw sot666 notes 1 and 2 ? 200 mw t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c t amb operating ambient temperature ? 65 +150 c per device p tot total power dissipation t amb 25 c sot363 note 1 ? 300 mw sot457 note 1 ? 600 mw sot666 notes 1 and 2 ? 300 mw
2004 apr 14 4 nxp semico nductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 thermal characteristics notes 1. device mounted on an fr4 printed-circuit board, single-sided copper, standard footprint. 2. reflow soldering is the only recommended soldering method. characteristics t amb = 25 c unless otherwise specified. symbol parameter conditions value unit per transistor r th(j-a) thermal resistance from junction to ambient t amb 25 c sot363 note 1 625 k/w sot457 note 1 417 k/w sot666 notes 1 and 2 625 k/w per device r th(j-a) thermal resistance from junction to ambient t amb 25 c sot363 note 1 416 k/w sot457 note 1 208 k/w sot666 notes 1 and 2 416 k/w symbol parameter conditions min. typ. max. unit i cbo collector-base cut-off current v cb = 50 v; i e = 0 a ? ? 100 na i ceo collector-emitter cut-off current v ce = 30 v; i b = 0 a ? ? 1 a v ce = 30 v; i b = 0 a; t j = 150 c ? ? 50 a i ebo emitter-base cut-off current v eb = 5 v; i c = 0 a ? ? 150 a h fe dc current gain v ce = 5 v; i c = 5 ma 100 ? ? v cesat collector-emitter saturation voltage i c = 5 ma; i b = 0.25 ma ? ? 100 mv v i(off) input-off voltage v ce = 5 v; i c = 100 a ? 0.7 0.5 v v i(on) input-on voltage v ce = 0.3 v; i c = 1 ma 1.4 0.8 ? v r1 input resistor 7 10 13 k resistor ratio 3.7 4.7 5.7 c c collector capacitance v cb = 10 v; i e = i e = 0 a; f = 1 mhz ? ? 2.5 pf r2 r1 ------- -
2004 apr 14 5 nxp semico nductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 package outlines unit b p cd e e 1 h e l p w references outline version european projection issue date 04-11-08 06-03-16 iec jedec jeita mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 dimensions (mm are the original dimensions) 0.3 0.1 sot666 b p pin 1 index d e 1 e a l p detail x h e e a s 0 1 2 mm scale a 0.6 0.5 c x 123 4 5 6 plastic surface-mounted package; 6 leads sot66 6 ys w m a
2004 apr 14 6 nxp semico nductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 references outline version european projection issue date iec jedec jeita sot457 sc-74 wb m b p d e pin 1 index a a 1 l p q detail x h e e v m a a b y scale c x 13 2 4 5 6 0 1 2 mm plastic surface-mounted package (tsop6); 6 leads sot45 7 unit a 1 b p cd e h e l p qy w v mm 0.1 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 05-11-07 06-03-16
2004 apr 14 7 nxp semico nductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 references outline version european projection issue date iec jedec jeita sot363 sc-88 wb m b p d e 1 e pin 1 index a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 6 plastic surface-mounted package; 6 leads sot36 3 unit a 1 max b p cd e e 1 h e l p qy w v mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 04-11-08 06-03-16
2004 apr 14 8 nxp semico nductors product data sheet npn/npn resistor-equipped transistors; r1 = 10 k , r2 = 47 k PIMH9; pumh9; pemh9 data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content, except for package outline drawings which were updated to the latest version. printed in the netherlands r75/04/pp9 date of release: 2004 apr 14 document order number: 9397 750 13091
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